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About This Item
Linear Formula:
(C4H8N6O)n
CAS Number:
UNSPSC Code:
12162002
NACRES:
NA.23
MDL number:
Product Name
Poly(melamine-co-formaldehyde) methylated, solution, average Mn ~432, 84 wt. % in 1-butanol
SMILES string
Nc1nc(nc(n1)N)N.O=C
InChI
1S/C3H6N6.CH2O/c4-1-7-2(5)9-3(6)8-1;1-2/h(H6,4,5,6,7,8,9);1H2
InChI key
IVJISJACKSSFGE-UHFFFAOYSA-N
form
liquid
mol wt
average Mn ~432
concentration
84 wt. % in 1-butanol
refractive index
n20/D 1.515
bp
118 °C
density
1.157 g/mL at 25 °C
Quality Level
Related Categories
Application
PMF can be used in the preparation of PVP-based ink, which can be used in inkjet printing for the development of electronic components such as:
- organic thin film transistor
- radio frequency capacitors
- parallel plate capacitors
- metal insulated metal (MIM) capacitor
General description
Poly(melamine-co-formaldehyde) methylated, solution (PMF) is a heat initiated cross-linking agent that forms an optically transparent solution. It can be linked with poly(4-vinly phenol) (PVP) by attaching with phenol groups that reduce the hydroxyl units in the blend.
signalword
Danger
hcodes
Hazard Classifications
Acute Tox. 4 Inhalation - Carc. 2 - Eye Dam. 1 - Skin Irrit. 2 - Skin Sens. 1
Storage Class
3 - Flammable liquids
wgk
WGK 1
flash_point_f
Not applicable
flash_point_c
Not applicable
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Scaling of contact metal induced hysteresis in solution processed organic thin film transistors.
Karunakaran L, et al
Organic Electronics, 65, 15-18 (2019)
Effects of processing variable on melamine-formaldehyde aerogel formation.
Nguyen MH and Dao L
Journal of Non-Crystalline Solids, 225, 51-57 (1998)
Inkjet-printed thin film radio-frequency capacitors based on sol-gel derived alumina dielectric ink.
McKerricher G, et al.
Ceramics International, 43(13), 9846-9853 (2017)
Poly (melamine-co-formaldehyde) methylated effect on the interface states of metal/polymer/p-Si Schottky barrier diode.
Tozlu C and Mutlu A
Synthetic Metals, 211, 99-106 (2016)
Inkjet Printed Parallel Plate Capacitors Using PVP Polymer Dielectric Ink on Flexible Polyimide Substrates.
IEEE Engineering in Medicine and Biology Society (EMBC), 4277-4280 (2018)
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