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Merck
CN

403393

Sigma-Aldrich

Nickel(II) bis(2,2,6,6-tetramethyl-3,5-heptanedionate)

97%

Synonym(s):

Ni(TMHD)2

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About This Item

Linear Formula:
Ni(OCC(CH3)3CHCOC(CH3)3)2
CAS Number:
Molecular Weight:
425.23
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:
NACRES:
NA.23
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Quality Level

Assay

97%

form

solid

reaction suitability

core: nickel

mp

219-223 °C (lit.)

SMILES string

CC(C)(C)C(=O)\C=C(\O[Ni]O\C(=C\C(=O)C(C)(C)C)C(C)(C)C)C(C)(C)C

InChI

1S/2C11H20O2.Ni/c2*1-10(2,3)8(12)7-9(13)11(4,5)6;/h2*7,12H,1-6H3;/q;;+2/p-2/b2*8-7+;

InChI key

PIIJAZNTPALBJL-ORWWTJHYSA-L

General description

Nickel(II) bis(2,2,6,6-tetramethyl-3,5-heptanedionate) [Ni(TMHD)₂] is a green crystalline solid that exhibits moderate volatility and good thermal stability, making it effective for use in vapor-phase processes. The bulky TMHD ligands enhance its volatility while maintaining thermal stability, making it suitable for chemical vapor deposition (CVD) and atomic layer deposition (ALD). These properties enable the controlled deposition of thin, uniform layers of nickel or nickel oxide on complex surfaces. Additionally, its solubility in organic solvents supports solution-based processing techniques. Its well-defined decomposition behaviour ensures clean film formation with minimal impurities, which is essential for electronic, catalytic, and energy-storage applications.

Application

Nickel(II) bis(2,2,6,6-tetramethyl-3,5-heptanedionate) (Ni(TMHD)₂) can be used as:
  • A precursor in the synthesis of nickel thin films via atomic layer deposition (ALD), which are used in solar cells, microelectronics and catalysis applications.
  • Metal precursor to for preparation of Ni-based catalysts via Atomic Layer Deposition.

Pictograms

Health hazardExclamation mark

Signal Word

Danger

Hazard Statements

Hazard Classifications

Acute Tox. 4 Oral - Carc. 1B

Storage Class Code

6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects

WGK

WGK 3

Flash Point(F)

Not applicable

Flash Point(C)

Not applicable

Personal Protective Equipment

dust mask type N95 (US), Eyeshields, Gloves

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