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Merck
CN

411167

Bisphenol A glycerolate (1 glycerol/phenol) diacrylate

contains MEHQ as inhibitor

Synonym(s):

2,2-Bis[4-(3-acryloyloxy-2-hydroxypropoxy)phenyl]propane, 2,2-Bis[acryloyloxy(2′-hydroxypropyloxy)phenyl]propane, Bisphenol A glycerolate diacrylate

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About This Item

Empirical Formula (Hill Notation):
C27H32O8
CAS Number:
Molecular Weight:
484.54
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12162002
EC Number:
225-144-3
MDL number:
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InChI key

VZTQQYMRXDUHDO-UHFFFAOYSA-N

InChI

1S/C27H32O8/c1-5-25(30)34-17-21(28)15-32-23-11-7-19(8-12-23)27(3,4)20-9-13-24(14-10-20)33-16-22(29)18-35-26(31)6-2/h5-14,21-22,28-29H,1-2,15-18H2,3-4H3

SMILES string

CC(C)(c1ccc(OCC(O)COC(=O)C=C)cc1)c2ccc(OCC(O)COC(=O)C=C)cc2

contains

MEHQ as inhibitor, 250-500 ppm MEHQ as inhibitor

refractive index

n20/D 1.557 (lit.)

viscosity

2000-4000 cP(65 °C)(lit.)

acid number

<5 mg KOH/g

density

1.18 g/mL at 25 °C (lit.)

Quality Level

Application

UV curable cross-linking agent. Component of curable inks, coatings, varnishes and lacquers.

Features and Benefits

High viscosity, non-volatile, difunctional acrylate. Gives fast cure speeds, low odor and low volatility.

Physical form

epoxy acrylate oligomer

pictograms

Exclamation mark

signalword

Warning

hcodes

Hazard Classifications

Skin Sens. 1

Storage Class

10 - Combustible liquids

wgk

WGK 3

flash_point_f

235.4 °F - closed cup

flash_point_c

113 °C - closed cup

ppe

Eyeshields, Faceshields, Gloves, type ABEK (EN14387) respirator filter


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B Björkner
Acta dermato-venereologica, 61(1), 7-10 (1981-01-01)
One commonly used prepolymer in ultraviolet (UV) curing inks is epoxy acrylate. Of 6 men with dermatitis contracted from UV-curing inks, 2 had positive patch test reaction to epoxy acrylate. None reacted to the chemically related bisphenol A dimethacrylate. The
D L Holness et al.
Contact dermatitis, 28(4), 216-219 (1993-04-01)
Epoxy resin of the bisphenol A type (ERBA) is a common cause of occupational contact dermatitis. 167 patients with a history of potential exposure were patch tested with epoxy resin (molecular weight 340) (ERBAM) 1% in pet. and with a
Li Li et al.
Electrophoresis, 33(16), 2591-2597 (2012-08-18)
Manufacturing materials are an essential element for the fabrication of microfluidic chips. PDMS, the most widely used polymeric material, is associated with apparent disadvantages such as hydrophobic nature, while other materials also suffer from some limitations. In this paper, a
Han N Lee et al.
American journal of contact dermatitis : official journal of the American Contact Dermatitis Society, 13(3), 108-115 (2002-08-08)
The study's objective was 2-fold: first, to evaluate the potential cross-reactivity between Bis-A epoxy resins and epoxy acrylates and second, to study the cross reactivity between Bis-A epoxy resins and newer Bis-F epoxy resins in patients with allergic contact dermatitis
Kristiina Aalto-Korte et al.
Contact dermatitis, 61(1), 9-21 (2009-08-08)
Contact allergy to epoxy (meth)acrylates, 2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy) phenyl]propane (bis-GMA), 2,2-bis[4-(2-hydroxy-3-acryloxypropoxy)phenyl]-propane (bis-GA), 2,2-bis[4-(methacryl-oxyethoxy)phenyl] propane (bis-EMA), 2,2-bis[4-(methacryloxy)phenyl]-propane (bis-MA), and glycidyl methacrylate (GMA) is often manifested together with contact allergy to diglycidyl ether of bisphenol A (DGEBA) epoxy resin. To analyse patterns of concomitant

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