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417696

Zinc bis[bis(trimethylsilyl)amide]

Name: Zinc bis[bis(trimethylsilyl)amide]
Brand: ALDRICH

97%, liquid

Synonym(s):

Bis[1,1,1-trimethyl-N-(trimethylsilyl)silanaminato]zinc, Bis[bis(trimethylsilyl)amido]zinc, Zinc bis(hexamethyldisilazide, 1,1,1,3,3,3-Hexamethyldisilazane zinc salt

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About This Item

Linear Formula:

[[(CH₃)₃Si]₂N]₂Zn

CAS Number:

14760-26-0

Molecular Weight:

386.16

UNSPSC Code:

12161600

PubChem Substance ID:

24866173

NACRES:

NA.22

MDL number:

MFCD01321225

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Properties

Product Name

Zinc bis[bis(trimethylsilyl)amide], 97%

Quality Level

100

assay

97%

form

liquid

reaction suitability

core: zinc, reagent type: catalyst

greener alternative product characteristics

Catalysis
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sustainability

Greener Alternative Product

mp

12.5 °C (lit.)

density

0.957 g/mL at 25 °C (lit.)

greener alternative category

Aligned,

SMILES string

C[Si](C)(C)N([Zn]N([Si](C)(C)C)[Si](C)(C)C)[Si](C)(C)C

InChI

1S/2C6H18NSi2.Zn/c2*1-8(2,3)7-9(4,5)6;/h2*1-6H3;/q2*-1;+2

InChI key

ZCCUYQBZUVUONI-UHFFFAOYSA-N

Description

General description

We are committed to bringing you Greener Alternative Products, which adhere to one or more of The 12 Principles of Greener Chemistry. This product has been enhanced for catalytic efficiency. Click here for more information.

Application

Cooperative effects of Schiff base binuclear zinc complexes on the synthesis of aliphatic and semi-aromatic polyesters.: This study explores the cooperative effects of binuclear zinc complexes in the synthesis of various polyesters, highlighting the potential of zinc bis[bis(trimethylsilyl)amide] in enhancing polymerization efficiency and selectivity (Santulli et al., 2023).

Synthesis, solution dynamics and chemical vapour deposition of heteroleptic zinc complexes via ethyl and amide zinc thioureides.: The authors discuss the synthesis and dynamics of zinc complexes for chemical vapor deposition, emphasizing the role of zinc bis[bis(trimethylsilyl)amide] as a precursor in developing high-purity metalorganic films (Bhide et al., 2021).