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767476

Copper

Name: Copper
Brand: ALDRICH

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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About This Item

Linear Formula:

CAS Number:

7440-50-8

Molecular Weight:

63.55

NACRES:

NA.23

PubChem Substance ID:

329767316

UNSPSC Code:

41141805

EC Number:

231-159-6

MDL number:

MFCD00010965

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Properties

assay

99.95% trace metals basis

form

turnings

reaction suitability

core: copper

resistivity

1.673 μΩ-cm, 20°C

diam. × thickness

2.00 in. × 0.25 in.

bp

2567 °C (lit.)

mp

1083.4 °C (lit.)

density

8.94 g/mL at 25 °C (lit.)

SMILES string

[Cu]

InChI

1S/Cu

InChI key

RYGMFSIKBFXOCR-UHFFFAOYSA-N

Description

Application

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

Storage Class

13 - Non Combustible Solids

WGK

WGK 2

Flash Point (°F)

Not applicable

Flash Point (°C)

Not applicable

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