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Merck
CN

337323

2-乙基己酸铜(II)

别名:

2-乙基己酸铜(2+), 2-乙基己酸铜(2+)盐, 二(2-乙基己酸)铜, 双(2-乙基己酸)铜

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线性分子式:
[CH3(CH2)3CH(C2H5)CO2]2Cu
化学文摘社编号:
分子量:
349.95
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12352103
EC Number:
205-731-0
MDL number:
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InChI key

SEKCXMNFUDONGJ-UHFFFAOYSA-L

InChI

1S/2C8H16O2.Cu/c2*1-3-5-6-7(4-2)8(9)10;/h2*7H,3-6H2,1-2H3,(H,9,10);/q;;+2/p-2

SMILES string

CCCCC(CC)C(=O)O[Cu]OC(=O)C(CC)CCCC

form

powder or chunks
solid

composition

Cu, 17.0-19.0% EDTA titration

reaction suitability

core: copper
reagent type: catalyst

mp

252 °C (dec.) (lit.)

Quality Level

Application

Copper(II) 2-ethylhexanoate is used as
  • A precursor in the trifluoroacetate metal-organic deposition process for fabricating YBaCuO₋y (YBCO) coated conductors, contributing to high critical current density and improved film quality.
  • A metal-organic precursor in photo deposition processes to synthesize metastable Ag–Cu alloy thin films under ambient conditions, for catalyzing the CO2 reduction reaction.
  • A copper catalyst in asymmetric aminative ring-opening reactions of tetrasubstituted donor–acceptor cyclopropanes, enabling the high yield and high enantioselective synthesis of α-tertiary amines.

General description

Copper(II) 2-ethylhexanoate is a crystalline solid that dissolves easily in nonpolar solvents. It exhibits moderate thermal stability and is often used as a catalyst or precursor in chemical vapor deposition and sol-gel processes. Its coordination structure allows it to form stable complexes, making it suitable for high-performance material applications.

pictograms

Health hazard

signalword

Danger

hcodes

Hazard Classifications

Repr. 1B

存储类别

6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects

wgk

WGK 3

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

dust mask type N95 (US), Eyeshields, Gloves


历史批次信息供参考:

分析证书(COA)

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Liqun Kang et al.
Nature communications, 11(1), 4008-4008 (2020-08-13)
Supported atomic metal sites have discrete molecular orbitals. Precise control over the energies of these sites is key to achieving novel reaction pathways with superior selectivity. Here, we achieve selective oxygen (O2) activation by utilising a framework of cerium (Ce)

商品

Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.

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