InChI key
SEKCXMNFUDONGJ-UHFFFAOYSA-L
InChI
1S/2C8H16O2.Cu/c2*1-3-5-6-7(4-2)8(9)10;/h2*7H,3-6H2,1-2H3,(H,9,10);/q;;+2/p-2
SMILES string
CCCCC(CC)C(=O)O[Cu]OC(=O)C(CC)CCCC
form
powder or chunks
solid
composition
Cu, 17.0-19.0% EDTA titration
reaction suitability
core: copper
reagent type: catalyst
mp
252 °C (dec.) (lit.)
Quality Level
Application
Copper(II) 2-ethylhexanoate is used as
- A precursor in the trifluoroacetate metal-organic deposition process for fabricating YBa₂Cu₃O₇₋y (YBCO) coated conductors, contributing to high critical current density and improved film quality.
- A metal-organic precursor in photo deposition processes to synthesize metastable Ag–Cu alloy thin films under ambient conditions, for catalyzing the CO2 reduction reaction.
- A copper catalyst in asymmetric aminative ring-opening reactions of tetrasubstituted donor–acceptor cyclopropanes, enabling the high yield and high enantioselective synthesis of α-tertiary amines.
General description
Copper(II) 2-ethylhexanoate is a crystalline solid that dissolves easily in nonpolar solvents. It exhibits moderate thermal stability and is often used as a catalyst or precursor in chemical vapor deposition and sol-gel processes. Its coordination structure allows it to form stable complexes, making it suitable for high-performance material applications.
signalword
Danger
hcodes
Hazard Classifications
Repr. 1B
存储类别
6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects
wgk
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
dust mask type N95 (US), Eyeshields, Gloves
Liqun Kang et al.
Nature communications, 11(1), 4008-4008 (2020-08-13)
Supported atomic metal sites have discrete molecular orbitals. Precise control over the energies of these sites is key to achieving novel reaction pathways with superior selectivity. Here, we achieve selective oxygen (O2) activation by utilising a framework of cerium (Ce)
商品
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
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