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643262

镀金硅片

Name: 镀金硅片
Brand: ALDRICH

99.999% (Au), layer thickness 1000 Å, 99.99% (Ti)

别名:

gold coated silicon, gold coated wafer

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关于此项目

线性分子式:

分子量:

196.97

NACRES:

NA.23

PubChem Substance ID:

329759955

UNSPSC Code:

12352103

MDL number:

MFCD00003436

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属性

Quality Segment

100

assay

99.99% (Ti), 99.999% (Au)

diam. × thickness

4 in. × 500 μm

layer thickness

1000 Å

matrix attachment

Titanium, as adhesion layer used to bind the gold to the silicon wafer.

SMILES string

[Au]

InChI

1S/Au

InChI key

PCHJSUWPFVWCPO-UHFFFAOYSA-N

说明

General description

钛粘附层，用于将金粘合到硅片 (100) 上。金取向名义上为具有 <111> 取向的高度多晶的。

Our gold-coated silicon wafers use electron-beam lithography to form amorphous layers (50Å of titanium followed by 1000Å of gold) on top of the silicon wafer.

Application

Gold coated silicon wafers may be used in soft lithography for micro and nanoscale patterning.

Packaging

Packaging 1 set in single wafer shipper

存储类别

11 - Combustible Solids

wgk

WGK 3

flash_point_f

Not applicable

flash_point_c