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Merck
CN

69860

Sigma-Aldrich

Molybdenum disulfide

greener alternative

powder

别名:

二硫化钼

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关于此项目

经验公式(希尔记法):
MoS2
化学文摘社编号:
分子量:
160.07
EC 号:
MDL编号:
UNSPSC代码:
12352300
PubChem化学物质编号:
NACRES:
NA.23
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产品名称

硫化钼 (IV), powder

表单

powder

环保替代产品特性

Design for Energy Efficiency
Learn more about the Principles of Green Chemistry.

sustainability

Greener Alternative Product

粒径

~6 μm (max. 40 μm)

密度

5.06 g/mL at 25 °C (lit.)

环保替代产品分类

SMILES字符串

S=[Mo]=S

InChI

1S/Mo.2S

InChI key

CWQXQMHSOZUFJS-UHFFFAOYSA-N

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一般描述

二硫化钼是一种二维层状材料。过渡金属二氢氯化物 (TMD) 单分子膜具有光导性。TMD 层可以被机械或化学剥落形成纳米片。
We are committed to bringing you Greener Alternative Products, which belongs to one of the four categories of greener alternatives. This enabling product has been enhanced for energy efficiency. Click here for more information.

应用

MoS 2 粒子的酸性的解决方案被用来催化在水 1,2-二氯乙烷接口的氢进化。将 MoS 2 分散在 N-甲基吡咯烷酮中,形成了不同粒径的 MoS 2 剥落片。MoS 2 油墨用于喷墨打印机。MoS 2 在电子学和光电子学中具有潜在的应用价值。

储存分类代码

11 - Combustible Solids

WGK

nwg

闪点(°F)

Not applicable

闪点(°C)

Not applicable

个人防护装备

Eyeshields, Gloves, type N95 (US)


历史批次信息供参考:

分析证书(COA)

Lot/Batch Number

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Preparation of high concentration dispersions of exfoliated MoS2 with increased flake size
O?Neill A, et al.
Chemistry of Materials, 24(12), 2414- 2421 (2012)
Hydrogen evolution at polarised liquid/liquid interfaces catalyzed by molybdenum disulfide.
Hatay I, et al.
Energy & Environmental Science, 4(10), 4246-4251 (2011)
"Inkjet Printing of MoS2
Li J, et al.
Advances in Functional Materials, 24(41), 6524-6531 (2014)
Ting Cao et al.
Nature communications, 3, 887-887 (2012-06-08)
A two-dimensional honeycomb lattice harbours a pair of inequivalent valleys in the k-space electronic structure, in the vicinities of the vertices of a hexagonal Brillouin zone, K(±). It is particularly appealing to exploit this emergent degree of freedom of charge
Branimir Radisavljevic et al.
ACS nano, 5(12), 9934-9938 (2011-11-15)
Logic circuits and the ability to amplify electrical signals form the functional backbone of electronics along with the possibility to integrate multiple elements on the same chip. The miniaturization of electronic circuits is expected to reach fundamental limits in the

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