767476
铜
sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis
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关于此项目
线性分子式:
Cu
化学文摘社编号:
分子量:
63.55
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
41141805
EC Number:
231-159-6
MDL number:
assay
99.95% trace metals basis
form
turnings
reaction suitability
core: copper
resistivity
1.673 μΩ-cm, 20°C
diam. × thickness
2.00 in. × 0.25 in.
bp
2567 °C (lit.)
mp
1083.4 °C (lit.)
density
8.94 g/mL at 25 °C (lit.)
SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
存储类别
13 - Non Combustible Solids
怎么回事？
WGK 2
闪点 (F)
Not applicable
闪点 (°C)
Not applicable