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经验公式(希尔记法):
C17H21N3
化学文摘社编号:
分子量:
267.37
MDL编号:
UNSPSC代码:
12352103
PubChem化学物质编号:
NACRES:
NA.23
质量水平
方案
97% (HPLC)
表单
solid
mp
105-110 °C
SMILES字符串
CN(C)c1ccc(cc1)C2N(C)c3ccccc3N2C
InChI
1S/C17H21N3/c1-18(2)14-11-9-13(10-12-14)17-19(3)15-7-5-6-8-16(15)20(17)4/h5-12,17H,1-4H3
InChI key
AKIIMLCQTGCWQQ-UHFFFAOYSA-N
一般描述
4-(2,3-二氢-1,3-二甲基-1H-苯并咪唑-2-基)-N,N-二甲基苯胺是一种半导体有机分子,具有π共轭多环系统。它是一种强电子供体分子,可用于n=型掺杂。它作为掺杂剂,电导率为〜2×10−3 S/cm。它还可充当有机化合物的还原转化试剂。
应用
它主要可用作制造电子设备的半导体聚合物,这些电子设备包括有机薄膜晶体管(OTFT)、聚合物太阳能电池(PSC)和有机发光二极管(OLED)。
空气稳定的 n 型掺杂剂,用于 n 沟道有机薄膜晶体管 (OTFT) 和太阳能电池 (OPV)。
警示用语:
Warning
危险声明
危险分类
Acute Tox. 4 Oral
储存分类代码
11 - Combustible Solids
WGK
WGK 3
闪点(°F)
Not applicable
闪点(°C)
Not applicable
Lu, Mingtao;
Applied Physics Letters, 99, 173302/1-173302/3 (2011)
In-situ Crosslinking and n-Doping of Semiconducting Polymers and Their Application as Efficient Electron-Transporting Materials in Inverted Polymer Solar Cells
Cho N, et al.
Advanced Energy Materials, 1(6), 1148-1153 (2011)
François Lapointe et al.
ACS applied materials & interfaces, 11(39), 36027-36034 (2019-09-19)
Although carbon nanotube transistors present outstanding performances based on key metrics, large-scale uniformity and repeatability required in printable electronics depend greatly on proper control of the electrostatic environment. Through a survey of polymer dielectric encapsulants compatible with printing processes, a
Use of a 1 H-benzoimidazole derivative as an n-type dopant and to enable air-stable solution-processed n-channel organic thin-film transistors
Wei P, et al.
Journal of the American Chemical Society, 132(26), 8852-8853 (2010)
Strong N-Doped Graphene: The Case of 4-(1, 3-Dimethyl-2, 3-dihydro-1 H-benzoimidazol-2-yl) phenyl) dimethylamine (N-DMBI
Denis PA and Iribarne F
The Journal of Physical Chemistry C, 119(27), 15103-15111 (2015)
商品
Fabrication procedure of organic field effect transistor device using a soluble pentacene precursor.
Solution-processed organic photovoltaic devices (OPVs) have emerged as a promising clean energy generating technology due to their ease of fabrication, potential to enable low-cost manufacturing via printing or coating techniques, and ability to be incorporated onto light weight, flexible substrates.
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