产品名称
Interdigitated Chip, IDE100D
material
gold/chromium electrode (Au/Cr)
silica coating (SiO2)
description
die layer thickness 300 nm SiO2
electrode layer thickness 60 nm gold
type 1
packaging
pkg of 12 diced devices
manufacturer/tradename
IDE100D
die thickness
525 μm , silicon
electrode size
10 nm , chrome
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General description
The spacing between the fingers on IDE100D is 50um. The fingers vary in thickness between 1um and 5um and in the number of fingers per device, from 9 to 13 fingers. The fingers are 550um long. Each device is about 1mmx1mm.
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