1.02700
Copper
foil about 0.1 mm thickness for analysis EMSURE®
别名:
Copper
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关于此项目
经验公式（希尔记法）:
Cu
化学文摘社编号:
分子量:
63.55
UNSPSC Code:
12141711
EC Index Number:
231-159-6
NACRES:
NA.21
MDL number:
产品名称
Copper, foil about 0.1 mm thickness for analysis EMSURE®
SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
product line
EMSURE®
assay
≥99.7% (iodometric)
form
solid
impurities
≤0.02% Substances insoluble in nitric acid
bp
2580 °C/1013 hPa
mp
1083 °C
density
8.96 g/cm3
bulk density
1000 kg/m3
cation traces
Ag: ≤0.002%
As: ≤0.0002%
Fe: ≤0.005%
Mn: ≤0.005%
Pb: ≤0.05%
Sb: ≤0.005%
Sn: ≤0.005%
storage temp.
2-30°C
Quality Level
相关类别
Analysis Note
Assay (iodometric): ≥ 99.7 %
Substances insoluble in nitric acid: ≤ 0.02 %
Ag (Silver): ≤ 0.002 %
As (Arsenic): ≤ 0.0002 %
Fe (Iron): ≤ 0.005 %
Mn (Manganese): ≤ 0.005 %
Pb (Lead): ≤ 0.05 %
Sb (Antimony): ≤ 0.005 %
Sn (Tin): ≤ 0.005 %
Substances insoluble in nitric acid: ≤ 0.02 %
Ag (Silver): ≤ 0.002 %
As (Arsenic): ≤ 0.0002 %
Fe (Iron): ≤ 0.005 %
Mn (Manganese): ≤ 0.005 %
Pb (Lead): ≤ 0.05 %
Sb (Antimony): ≤ 0.005 %
Sn (Tin): ≤ 0.005 %
Application
- Electron-electron scattering limits thermal conductivity of metals under extremely high electron temperatures: The study discusses how copper′s thermal properties are influenced under extreme conditions, applicable in high-performance electronics (Karna and Giri, 2024).
- Lateral Flow Assay Biotesting by Utilizing Plasmonic Nanoparticles Made of Inexpensive Metals: Demonstrates copper′s potential as a cost-effective alternative to gold in diagnostic assays, broadening access to healthcare technologies (Bahamondes Lorca et al., 2024).
Legal Information
EMSURE is a registered trademark of Merck KGaA, Darmstadt, Germany
存储类别
13 - Non Combustible Solids
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable
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