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Merck
CN

316989

过氧化氢 溶液

contains potassium stannate as inhibitor, 30-32 wt. % in water, semiconductor grade, 99.999% trace metals basis

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关于此项目

经验公式(希尔记法):
H2O2
化学文摘社编号:
分子量:
34.01
PubChem Substance ID:
UNSPSC Code:
12352300
Beilstein/REAXYS Number:
3587191
MDL number:
Assay:
99.999% trace metals basis
Form:
liquid
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SMILES string

OO

InChI

1S/H2O2/c1-2/h1-2H

InChI key

MHAJPDPJQMAIIY-UHFFFAOYSA-N

vapor density

1 (vs air)

vapor pressure

23.3 mmHg ( 30 °C)

assay

99.999% trace metals basis

form

liquid

contains

potassium stannate as inhibitor, stabilizer

reaction suitability

reagent type: oxidant

concentration

30-32 wt. % in water, semiconductor grade

density

1.11 g/mL at 25 °C

storage temp.

2-8°C

Quality Level

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General description

Hydrogen peroxide solution is a widely used oxidizing agent in a variety of applications, including the oxidation of cyanide in industrial waste samples, the removal of ammonia from semiconductor wastewater, the removal of ibuprofen from water and wastewater, and the treatment of wastewater containing five-membered heterocyclic pyrazoles. It is one of the most widely used wet electronic chemicals.

Application

Hydrogen peroxide solution can be used in the substrate preparation for ultrathin polymer films.

pictograms

Corrosion

signalword

Danger

hcodes

Hazard Classifications

Aquatic Chronic 3 - Eye Dam. 1

存储类别

5.1B - Oxidizing hazardous materials

wgk

WGK 1

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter

法规信息

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历史批次信息供参考:

分析证书(COA)

Lot/Batch Number

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Yang J, et al.
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Photochemical reduction of gold (III) on semiconductor dispersions of TiO2 in the presence of CN- ions: disposal of CN- by treatment with hydrogen peroxide
Serpone N, et al.
Journal of Photochemistry, 36, 373-388 (1987)
Integrated countercurrent reverse osmosis cascades for hydrogen peroxide ultrapurification
Abejon R, et al.
Computers & Chemical Engineering, 41, 67-76 (2012)
Fabrication of large-area free-standing ultrathin polymer films
Stadermann M, et al.
Journal of Visualized Experiments, e52832-e52832 (2015)

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