packaging
case of 3 ea
manufacturer/tradename
SynVivo 105001-SR3
storage temp.
room temp
General description
SynRAm inflammation model co-culture chip- Microvascular design Barrier type: Pillars, Distance between pillars: 50 μm, Pillar Diameter: 10 μm, Barrier height: 3 μm, Travel/barrier width: 50 μm, Device depth: 100 μm. The SynRAM 3D Inflammation Model has been developed to study the entire inflammation pathway in a realistic and dynamic environment.
Other Notes
LInk to Publications application text
Still not finding the right product?
Explore all of our products under SynVivo SynRAM 3D Inflammation model chip, SMN2 microvascular network configuration