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Merck
CN

164410

Benzocyclobutene

97%

Synonym(s):

Bicyclo[4.2.0]octa-1,3,5-triene

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About This Item

Empirical Formula (Hill Notation):
C8H8
CAS Number:
694-87-1
Molecular Weight:
104.15
NACRES:
NA.22
PubChem Substance ID:
24850072
UNSPSC Code:
12352100
MDL number:
MFCD01321219
Assay:
97%
Form:
liquid

Key Documents

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InChI

1S/C8H8/c1-2-4-8-6-5-7(8)3-1/h1-4H,5-6H2

SMILES string

C1Cc2ccccc12

InChI key

UMIVXZPTRXBADB-UHFFFAOYSA-N

assay

97%

form

liquid

refractive index

n20/D 1.541 (lit.)

bp

150 °C/748 mmHg (lit.)

density

0.957 g/mL at 25 °C (lit.)

Quality Level

100

Related Categories

Application

Benzocyclobutene was used as the adhesive bonding material in adhesive wafer-level bonding technique. Photosensitive benzocyclobutene has been widely used as dielectric material in multilayer packaging applications. It was used in fabrication of high density multilayer interconnect structures using gold metallization and polymer interlayer dielectric.

pictograms

Flame
GHS02

signalword

Warning

hcodes

H226

Hazard Classifications

Flam. Liq. 3

Storage Class

3 - Flammable liquids

wgk

WGK 3

flash_point_f

96.8 °F - closed cup

flash_point_c

36 °C - closed cup

ppe

Eyeshields, Faceshields, Gloves, type ABEK (EN14387) respirator filter

Regulatory Information

危险化学品
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Certificates of Analysis (COA)

Lot/Batch Number
MKCW5239
MKCS1608
MKCQ5398
MKCQ0059
MKCM7749

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Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities.
Oberhammer J, et al.
Sens. Actuators, 105(3), 297-304 (2003)
Processing and microwave characterization of multilevel interconnects using benzocyclobutene dielectric.
Chinoy PB and Tajadod J.
IEEE Transactions on Components, Hybrids, and Manufacturing, 16(7), 714-719 (1993)
Photosensitive benzocyclobutene for stress-buffer and passivation applications (one mask manufacturing process).
Strandjord AJG, et al.
Electronic Components and Technology Conference, 1997. Proceedings., 47th. IEEE, 47 (1997)

Articles

Organic Materials for Thin Film Transistors

Flexible electronic circuits, displays, and sensors based on organic active materials will enable future generations of electronics products that may eventually enter the mainstream electronics market.

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