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InChI key
SEKCXMNFUDONGJ-UHFFFAOYSA-L
InChI
1S/2C8H16O2.Cu/c2*1-3-5-6-7(4-2)8(9)10;/h2*7H,3-6H2,1-2H3,(H,9,10);/q;;+2/p-2
SMILES string
CCCCC(CC)C(=O)O[Cu]OC(=O)C(CC)CCCC
form
powder or chunks
solid
composition
Cu, 17.0-19.0% EDTA titration
reaction suitability
core: copper
reagent type: catalyst
mp
252 °C (dec.) (lit.)
Quality Level
Application
- A precursor in the trifluoroacetate metal-organic deposition process for fabricating YBa₂Cu₃O₇₋y (YBCO) coated conductors, contributing to high critical current density and improved film quality.
- A metal-organic precursor in photo deposition processes to synthesize metastable Ag–Cu alloy thin films under ambient conditions, for catalyzing the CO2 reduction reaction.
- A copper catalyst in asymmetric aminative ring-opening reactions of tetrasubstituted donor–acceptor cyclopropanes, enabling the high yield and high enantioselective synthesis of α-tertiary amines.
General description
signalword
Danger
hcodes
Hazard Classifications
Repr. 1B
Storage Class
6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects
wgk
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
dust mask type N95 (US), Eyeshields, Gloves
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Articles
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
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