349178
Copper
foil, thickness 0.25 mm, 99.98% trace metals basis
Synonym(s):
Copper sheet
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About This Item
Empirical Formula (Hill Notation):
Cu
CAS Number:
Molecular Weight:
63.55
EC Number:
MDL number:
UNSPSC Code:
11101604
PubChem Substance ID:
NACRES:
NA.23
Quality Level
Assay
99.98% trace metals basis
form
foil
resistivity
1.673 μΩ-cm, 20°C
thickness
0.25 mm
bp
2567 °C (lit.)
mp
1083.4 °C (lit.)
density
8.94 g/mL at 25 °C (lit.)
application(s)
battery manufacturing
SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
General description
Copper foil with a thickness of 0.25 mm and a 99.98% trace metals basis is a top-quality product that has numerous industrial and commercial applications. It is produced using cutting-edge manufacturing processes that ensure superior quality and consistency. The foil is carefully inspected to meet the specified purity level and is free from any imperfections like scratches, dents, and tears. Copper foil is a highly versatile material that offers outstanding electrical conductivity, thermal conductivity, and corrosion resistance.
Application
Copper foil is commonly used in a variety of applications such as printed circuit boards (PCBs), electromagnetic shielding, and as a substrate in chemical vapor deposition. The 0.25 mm thickness of this foil makes it suitable for many applications, providing sufficient strength and durability while remaining easy to handle and manipulate. The 99.98% trace metals basis ensures that the copper foil is of the highest quality, with only minimal levels of impurities like lead, arsenic, and bismuth. This level of purity is critical for many industrial applications, particularly those in the electronics industry, where even small amounts of impurities can significantly impact the performance and reliability of the end product.
Preparation Note
50×50 mm (approximately 5.5 g)
150×150 mm (approximately 49.5 g)
150×150 mm (approximately 49.5 g)
Storage Class Code
13 - Non Combustible Solids
WGK
WGK 2
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Personal Protective Equipment
dust mask type N95 (US), Eyeshields, Gloves
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R Squitti et al.
Neurology, 67(1), 76-82 (2006-07-13)
To assess whether serum copper in Alzheimer disease (AD) correlates with cognitive scores, beta-amyloid, and other CSF markers of neurodegeneration. The authors studied copper, ceruloplasmin, total peroxide, and antioxidants levels (TRAP) in serum; beta-amyloid in plasma; and copper, beta-amyloid, h-tau
Seiko Ishida et al.
Proceedings of the National Academy of Sciences of the United States of America, 110(48), 19507-19512 (2013-11-13)
Copper is an essential trace element, the imbalances of which are associated with various pathological conditions, including cancer, albeit via largely undefined molecular and cellular mechanisms. Here we provide evidence that levels of bioavailable copper modulate tumor growth. Chronic exposure
Stephen G Kaler et al.
The New England journal of medicine, 358(6), 605-614 (2008-02-08)
Menkes disease is a fatal neurodegenerative disorder of infancy caused by diverse mutations in a copper-transport gene, ATP7A. Early treatment with copper injections may prevent death and illness, but presymptomatic detection is hindered by the inadequate sensitivity and specificity of
Magnus Andersson et al.
Nature structural & molecular biology, 21(1), 43-48 (2013-12-10)
Heavy metals in cells are typically regulated by PIB-type ATPases. The first structure of the class, a Cu(+)-ATPase from Legionella pneumophila (LpCopA), outlined a copper transport pathway across the membrane, which was inferred to be occluded. Here we show by
Daniel L Priebbenow et al.
Organic letters, 15(24), 6155-6157 (2013-11-28)
A method has been developed for the preparation of N-alkynylated sulfoximines involving the copper-catalyzed decarboxylative coupling of sulfoximines with aryl propiolic acids. A range of substituents on both the sulfoximidoyl moiety and the aryl group of the propiolic acid were
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