InChI
1S/C17H8N2O5.C13H12N2O/c20-13(7-1-3-9-11(5-7)16(23)18-14(9)21)8-2-4-10-12(6-8)17(24)19-15(10)22;14-11-5-1-3-9(7-11)13(16)10-4-2-6-12(15)8-10/h1-6H,(H,18,21,23)(H,19,22,24);1-8H,14-15H2
InChI key
CLNYWOAUAVHHOL-UHFFFAOYSA-N
form
powder
dielectric constant
3.3, 1 MHz
mp
>500 °C (lit.)
transition temp
Tg 245 °C, Tm 276 °C (DSC, 20°C/min)
Application
Adhesive for wide area bonding of metals, ceramics and polyimide films. Molding powder, varnish component and glass fiber cloth prepreg.
Features and Benefits
Can be imidized at a low temperature and processed as a thermoplastic. High chemical resistance to almost all chemicals and organic solvents. Highly thermo-oxidative and chemically stable polyimide developed by NASA. No weight loss up to 400°C
Physical form
Crystalline (30%) linear polyimide powder.
Storage Class
11 - Combustible Solids
wgk
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
Eyeshields, Gloves, type N95 (US)
Regulatory Information
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