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Merck
CN

40253

Hydrochloric acid

fuming 37%, 37-38%

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About This Item

Empirical Formula (Hill Notation):
HCl
CAS Number:
Molecular Weight:
36.46
EC Number:
231-595-7
UNSPSC Code:
12352301
PubChem Substance ID:
Beilstein/REAXYS Number:
1098214
MDL number:
Assay:
37-38%
Concentration:
30-50%
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vapor density

1.3 (vs air)

vapor pressure

3.23 psi ( 21.1 °C), 7.93 psi ( 37.7 °C)

assay

37-38%

CofA

specification on request

concentration

30-50%

color

light yellow

bp

>100 °C (lit.)

solubility

H2O: soluble

density

1.18 g/mL at 20 °C

SMILES string

Cl

InChI

1S/ClH/h1H

InChI key

VEXZGXHMUGYJMC-UHFFFAOYSA-N

General description

Semiconductor grade hydrochloric acid has been characterized by inductively couple plasma mass spectrometry (ICP-MS). The trace detection of V, Cr, As and Se in 20% HCl was determined in the study. It′s efficiency as a microabrasive was studied.

Application

Hydrochloric acid may be used in the formulation of “standard cleaning bath” to purify metallurgical grade silicon (MGS) and polysilicon. Varying concentrations of the acid aided formation of spherical and rod like cellulose nanocrystals. Aqueous mixture of hydrochloric acid and Α-hydroxy acids (lactic, citric, malic, and tartaric acids) may be used to etch a III-V semiconductor (InP).


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pictograms

CorrosionExclamation mark

signalword

Danger

Hazard Classifications

Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1B - STOT SE 3

target_organs

Respiratory system

Storage Class

8B - Non-combustible corrosive hazardous materials

wgk

WGK 1

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter

Regulatory Information

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Electrochemical properties of metallurgical-grade silicon in hydrochloric acid.
Kareh KA
Electrochimica Acta, 54(26), 6548-6553 (2009)
Analysis of semiconductor-grade HCl with the ELAN DRC ICP-MS: elimination of chloride-based interferences.
Kishi Y and Kawabata K
Atomic Spectroscopy, 23(5), 165-169 (2002)
Semiconductor Surface-Molecule Interactions, Wet etching of InP by ?-hydroxy acids
Bandaru P and Yablonovitch E
Journal of the Electrochemical Society, 149, G599-G602 (2002)