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Merck
CN

40267

Hydrogen peroxide solution

≥30%

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About This Item

Empirical Formula (Hill Notation):
H2O2
CAS Number:
Molecular Weight:
34.01
PubChem Substance ID:
UNSPSC Code:
12352300
Beilstein/REAXYS Number:
3587191
MDL number:
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vapor pressure

23.3 mmHg ( 30 °C)

assay

≥30%

CofA

specification on request

reaction suitability

reagent type: oxidant

density

1.110 g/cm3

storage temp.

2-8°C

SMILES string

OO

InChI

1S/H2O2/c1-2/h1-2H

InChI key

MHAJPDPJQMAIIY-UHFFFAOYSA-N

General description

Hydrogen peroxide is a strong oxidizer. It may be produced industrially by anthraquinone oxidation. it is used in semiconductor industry essentially for cleaning silicon wafers, removal of photoresists and to etch metallic copper on printed circuit boards. Ultrapurification of hydrogen peroxide by reverse osmosis has been reported in detail.

Application

Semiconductor grade hydrogen peroxide was used to etch TiN 2 and GaAs structures.


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pictograms

Corrosion

signalword

Danger

hcodes

Hazard Classifications

Aquatic Chronic 3 - Eye Dam. 1

Storage Class

5.1B - Oxidizing hazardous materials

wgk

WGK 1

flash_point_f

Not applicable

flash_point_c

Not applicable

ppe

Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter

Regulatory Information

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TiN metal hardmask etch residue removal on advanced porous low-k and Cu device with corner rounding scheme
Cui H, et al.
Solid State Phenomena, 187 (2012)
Localized GaAs etching with acidic hydrogen peroxide solutions
Shaw DW, et al.
Journal of the Electrochemical Society, 128(4), 874-880 (1981)
Ultrapurification of hydrogen peroxide solution from ionic metals impurities to semiconductor grade by reverse osmosis.
Abejon R, et al.
Separation and Purification Technology, 76(1), 44-51 (2010)