40307
Hydrogen peroxide solution
≥30%
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About This Item
Empirical Formula (Hill Notation):
H2O2
CAS Number:
Molecular Weight:
34.01
PubChem Substance ID:
UNSPSC Code:
12352304
Beilstein/REAXYS Number:
3587191
MDL number:
Assay:
≥30%
Concentration:
25-35%
vapor pressure
23.3 mmHg ( 30 °C)
assay
≥30%
CofA
specification on request
shelf life
~2 yr
reaction suitability
reagent type: oxidant
concentration
25-35%
density
1.110 g/cm3
storage temp.
2-8°C
SMILES string
OO
InChI
1S/H2O2/c1-2/h1-2H
InChI key
MHAJPDPJQMAIIY-UHFFFAOYSA-N
General description
Hydrogen peroxide is a strong oxidizer. It may be produced industrially by anthraquinone oxidation. it is used in semiconductor industry essentially for cleaning silicon wafers, removal of photoresists and to etch metallic copper on printed circuit boards. Ultrapurification of hydrogen peroxide by reverse osmosis has been reported in detail.
Application
Semiconductor grade hydrogen peroxide was used to etch TiN 2 and GaAs structures.
Legal Information
PURANAL is a trademark of Honeywell Specialty Chemicals Seelze GmbH
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Danger
hcodes
Hazard Classifications
Aquatic Chronic 3 - Eye Dam. 1
Storage Class
5.1B - Oxidizing hazardous materials
wgk
WGK 1
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter
Regulatory Information
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TiN metal hardmask etch residue removal on advanced porous low-k and Cu device with corner rounding scheme
Cui H, et al.
Solid State Phenomena, 187 (2012)
Localized GaAs etching with acidic hydrogen peroxide solutions
Shaw DW, et al.
Journal of the Electrochemical Society, 128(4), 874-880 (1981)
Jose M Campos-Martin et al.
Angewandte Chemie (International ed. in English), 45(42), 6962-6984 (2006-10-14)
Hydrogen peroxide (H2O2) is widely used in almost all industrial areas, particularly in the chemical industry and environmental protection. The only degradation product of its use is water, and thus it has played a large role in environmentally friendly methods