403342
Copper(I) acetate
97%
Synonym(s):
Copper monoacetate, Cuprous acetate
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About This Item
Recommended Products
Quality Level
Assay
97%
form
powder and chunks
reaction suitability
core: copper
reagent type: catalyst
mp
250 °C (dec.) (lit.)
SMILES string
CC(=O)O[Cu]
InChI
1S/C2H4O2.Cu/c1-2(3)4;/h1H3,(H,3,4);/q;+1/p-1
InChI key
RFKZUAOAYVHBOY-UHFFFAOYSA-M
1 of 4
This Item | 399973 | 215554 | 208825 |
---|---|---|---|
form powder and chunks | form crystals and lumps, solid | form powder and chunks | form powder |
assay 97% | assay 99.99% trace metals basis | assay 99.999% trace metals basis | assay 97% |
mp 250 °C (dec.) (lit.) | mp 298 °C (dec.) (lit.) | mp 605 °C (lit.) | mp - |
reaction suitability core: copper | reaction suitability core: cobalt | reaction suitability - | reaction suitability - |
Quality Level 200 | Quality Level 200 | Quality Level 200 | Quality Level 200 |
Storage Class Code
11 - Combustible Solids
WGK
WGK 3
Flash Point(F)
Not applicable
Flash Point(C)
Not applicable
Personal Protective Equipment
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Articles
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
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