667528
Copper etchant
Synonym(s):
Copper etching solution
vapor density
1.3 (vs air)
Quality Level
Related Categories
Application
CE-200 solution can be used to etch out the copper residue or foil from the chemical vapor deposited (CVD) graphene or carbonated films by immersing the substrate with the nanomaterial into the etchant solution for 30 min.
It is ideal for spray etching of copper. Ferric chloride based Cu etchant with etch rate of 0.5 mil/min @ 40 °C.
signalword
Danger
hcodes
Hazard Classifications
Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1
Storage Class
8B - Non-combustible corrosive hazardous materials
wgk
WGK 1
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter
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Nemani SK, et al.
Journal of Nanomaterials, 2018(1-3), 63-68 (2018)
Fangyuan Zheng et al.
ACS nano, 14(2), 2137-2144 (2020-01-18)
The emergent two-dimensional (2D) materials are atomically thin and ultraflexible, promising for a variety of miniaturized, high-performance, and flexible devices in applications. On one hand, the ultrahigh flexibility causes problems: the prevalent wrinkles in 2D materials may undermine the ideal
The effect of copper pre-cleaning on graphene synthesis
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Copper etching with cupric chloride and regeneration of waste etchant
Cakir O
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