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Merck
CN

756717

Bisphenol F, mixture of acetates and propionates

Synonym(s):

4,4′-Methylenebisphenol, bis(mixed acetates and propionates), EC-298

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About This Item

CAS Number:
UNSPSC Code:
12162002
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form

liquid

refractive index

n20/D 1.549

density

1.143 g/mL at 25 °C

storage temp.

2-8°C

Application

BPF is a resin that can be used in the development of high strength materials in aircrafts and electronic products. It can form a variety of engineering plastics for industrial applications.
Epoxy curative with good thermal properties.
  • Stable
  • Low viscosity
  • Does not impede free radical cure
  • Thermoset adhesives
  • Curative for epoxy/(meth) acrylate hybrids
  • Hybrid epoxy/free radical thermosets

General description

Bisphenol F (BPF) is an epoxy based resin that can be used as an engineering polymer. It has a low viscosity, high thermal stability and chemical resistance. It can be used in anticorrosive coatings and epoxy based adhesives. It can be cured by using amine and anhydride based hardeners. It has an epoxy value of 0.549 mol/100g.

pictograms

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Warning

hcodes

Hazard Classifications

Acute Tox. 4 Oral - Eye Irrit. 2

Storage Class

10 - Combustible liquids

wgk

WGK 3

flash_point_f

Not applicable

flash_point_c

Not applicable

Regulatory Information

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Novel surface modified molecularly imprinted polymer focused on the removal of interference in environmental water samples for chromatographic determination.
Watabe Y, et al.
Journal of Chromatography A, 1073(1-2), 363-370 (2005)
Cure kinetics, gelation, and glass transition of a bisphenol F epoxide.
O'Brien DJ and White SR
Polym. Eng. Sci., 43(4), 863-874 (2003)
Curing kinetics and thermal property characterization of the bisphenol-F epoxy resin and phthalic anhydride system.
Gao J, et al.
Polymer International, 51(12), 1422-1427 (2002)
Effective functionalization of carbon nanotubes for bisphenol F epoxy matrix composites.
Wang Z, et al.
Materials Research, 15(4), 510-516 (2012)
Flame-retardant electrical conductive nanopolymers based on bisphenol F epoxy resin reinforced with nano polyanilines.
Zhang X, et al.
ACS Applied Materials & Interfaces, 5(3), 898-910 (2013)

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