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About This Item
CAS Number:
UNSPSC Code:
12162002
form
liquid
refractive index
n20/D 1.549
density
1.143 g/mL at 25 °C
storage temp.
2-8°C
Application
BPF is a resin that can be used in the development of high strength materials in aircrafts and electronic products. It can form a variety of engineering plastics for industrial applications.
Epoxy curative with good thermal properties.
- Stable
- Low viscosity
- Does not impede free radical cure
- Thermoset adhesives
- Curative for epoxy/(meth) acrylate hybrids
- Hybrid epoxy/free radical thermosets
General description
Bisphenol F (BPF) is an epoxy based resin that can be used as an engineering polymer. It has a low viscosity, high thermal stability and chemical resistance. It can be used in anticorrosive coatings and epoxy based adhesives. It can be cured by using amine and anhydride based hardeners. It has an epoxy value of 0.549 mol/100g.
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Warning
hcodes
pcodes
Hazard Classifications
Acute Tox. 4 Oral - Eye Irrit. 2
Storage Class
10 - Combustible liquids
wgk
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
Regulatory Information
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Novel surface modified molecularly imprinted polymer focused on the removal of interference in environmental water samples for chromatographic determination.
Watabe Y, et al.
Journal of Chromatography A, 1073(1-2), 363-370 (2005)
Cure kinetics, gelation, and glass transition of a bisphenol F epoxide.
O'Brien DJ and White SR
Polym. Eng. Sci., 43(4), 863-874 (2003)
Curing kinetics and thermal property characterization of the bisphenol-F epoxy resin and phthalic anhydride system.
Gao J, et al.
Polymer International, 51(12), 1422-1427 (2002)
Effective functionalization of carbon nanotubes for bisphenol F epoxy matrix composites.
Wang Z, et al.
Materials Research, 15(4), 510-516 (2012)
Flame-retardant electrical conductive nanopolymers based on bisphenol F epoxy resin reinforced with nano polyanilines.
Zhang X, et al.
ACS Applied Materials & Interfaces, 5(3), 898-910 (2013)
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