901823
Nickel electroplating solution
Synonym(s):
Ni electroplating solution, Ni plating solution
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About This Item
NACRES:
NA.23
UNSPSC Code:
12352303
form
liquid
contains
1.25 g/L±0.125 g/L stabilizer, 0.015 g/L±0.0015 g/L wetting agent, 4.25 g/L±0.25 g/L Stress reducer
composition
30 g/L ±0.5 g/L H3BO3 , 170g/L ±5 g/L Ni(SO3NH2)2.4H2O , 9.51 g/L ±1 g/L NiBr2 .xH2O
General description
Nickel electroplating solution is designed for the fabrication of low stress, smooth and pinhole-free nickel films.
Features and Benefits
- Deposits have low internal stress and are very ductile.
- Surfaces are uniform and smooth with well-controlled thickness and excellent uniformity.
- As plated Ni films have small grains in the range of 10 - 50 nm. Grain size orientations are (111) and (200) for FCC (face centred cubic).
- Qualified bath metrology for replenishment and a long shelf life.
Electroplated Ni film (5-10 μm thickness) properties:
- Density: 8.1 g/cm3
- Young′s modulus: 210 GPa
- Internal stress 33 ± 13 MPa
- Tensile strength: 585 ± 40 MPa
- Grain size: 10-50 nm
signalword
Danger
Hazard Classifications
Aquatic Chronic 2 - Carc. 1A Inhalation - Eye Dam. 1 - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Sens. 1 - STOT RE 1 - STOT RE 2 Inhalation
target_organs
Respiratory Tract
wgk
WGK 3
flash_point_f
Not applicable
flash_point_c
Not applicable
Regulatory Information
危险化学品
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Global Trade Item Number
| SKU | GTIN |
|---|---|
| 901823-1L | 04061834898610 |
| 901823-500ML | 04061834899396 |