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About This Item
Linear Formula:
(C6H5)2SiCl2
CAS Number:
Molecular Weight:
253.20
Beilstein:
609882
EC Number:
MDL number:
UNSPSC Code:
12352103
PubChem Substance ID:
NACRES:
NA.23
vapor density
>1 (vs air)
Quality Level
vapor pressure
2 mmHg ( 125 °C)
Assay
97%
form
liquid
refractive index
n20/D 1.578 (lit.)
bp
305 °C (lit.)
density
1.204 g/mL at 25 °C (lit.)
SMILES string
Cl[Si](Cl)(c1ccccc1)c2ccccc2
InChI
1S/C12H10Cl2Si/c13-15(14,11-7-3-1-4-8-11)12-9-5-2-6-10-12/h1-10H
InChI key
OSXYHAQZDCICNX-UHFFFAOYSA-N
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General description
Dichlorodiphenylsilane is a silane based surface modifier, and a precursor which can be used in the synthesis of silica based materials. It is used to modify the surface by providing toughness, durability and resistance to shock.
Application
Dichlorodiphenylsilane can be used in the synthesis of a host material for the fabrication of blue phosphorescent organic light emitting diodes (OLEDs).
The addition reaction of dichlorodiphenylsilane with diglycidyl ether of bisphenol-S yields poly(silyl ether) with pendant chloromethyl groups. {40} The coupling reaction between dichloromethylsilane and dichlorodiphenylsilane can form diorganosilane-hydrosilane copolymers at -75oC. Heating the compound with tetrabutoxydianilinocyclophosphazene at temperatures between 100oC-160oC may yield cyclophosphazene oligomers.{42}
Signal Word
Danger
Hazard Statements
Precautionary Statements
Hazard Classifications
Acute Tox. 2 Dermal - Skin Corr. 1B
Storage Class Code
6.1A - Combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
WGK
WGK 1
Flash Point(F)
287.6 °F - closed cup
Flash Point(C)
142 °C - closed cup
Personal Protective Equipment
dust mask type N95 (US), Eyeshields, Gloves
Regulatory Information
危险化学品
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Si-H functional polysilanes via a homogeneous reductive coupling reaction.
Sacarescu G, et al.
Macromolecular Rapid Communications, 22(6), 405-408 (2001)
Synthesis of poly (silyl ether) by the addition reaction of bisphenol-S diglycidyl ether and dichlorodiphenylsilane.
Liaw DJ
Polymer, 38(20), 5217-5219 (1997)
Preparation and Properties of Polysiloxane Modified Epoxy Encapsulating Material
Advanced Materials Research, 1021(6), 3-6 (2014)
Diphenylsilanes containing electronically isolated carbazolyl fragments as host materials for light emitting diodes
Zostautiene R, et al.
Synthetic Metals, 161(1-2), 92-95 (2011)
Phosphonitrilic chloride XXVIII. Synthesis of cyclophosphazene polymers by polycondensation between tetrabutoxydianilinocyclotriphosphazene and dichlorodiphenylsilane.
Kajiwara M, et al.
Macromolecular Materials and Engineering, 46(1), 63-72 (1975)
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