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455199

Tetrakis(dimethylamido)hafnium(IV)

≥99.99%

Synonym(s):

TDMAH, Tetrakis(dimethylamino)hafnium(IV)

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About This Item

Linear Formula:
[(CH3)2N]4Hf
CAS Number:
19782-68-4
Molecular Weight:
354.79
NACRES:
NA.23
PubChem Substance ID:
24869038
UNSPSC Code:
12352103
MDL number:
MFCD01862473
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Quality Segment

assay

≥99.99%

form

low-melting solid

reaction suitability

core: hafnium

mp

26-29 °C (lit.)

density

1.098 g/mL at 25 °C

SMILES string

CN(C)[Hf](N(C)C)(N(C)C)N(C)C

InChI

1S/4C2H6N.Hf/c4*1-3-2;/h4*1-2H3;/q4*-1;+4

InChI key

ZYLGGWPMIDHSEZ-UHFFFAOYSA-N

General description

Tetrakis(dimethylamido)hafnium(IV) is an organometallic compound consisting of a central hafnium atom (Hf) surrounded by four dimethylamido ligands (NMe2). It is commonly used as a CVD/ALD precursor to produce high-quality Hf thin films. It is a solid with low melting point.

Application

Tetrakis(dimethylamido)hafnium(IV) can be used:
  • As an atomic layer deposition(ALD) precursor for deposition of hafnium oxide thin films for advanced semiconductor devices.
  • As a precursor to fabricate polymer-derived ceramic nanocomposites.
  • To prepare HfO2, CeO2, and Ce-doped HfO2 thin films on Ge substrates by using tris(isopropyl-cyclopentadienyl)cerium [Ce(iPrCp)3] precursors with H2O via ALD method.
  • To produce Hf3N4 thin films with TDMAH and ammonia at low substrate temperatures at 150−250 °C.

Analysis Note

Purity excludes ~2000 ppm Zr.

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Pictograms

FlameCorrosion
GHS02,GHS05

Signal Word

Danger

Hazard Codes

H228,H261,H314

supp_hazards

EUH014

Storage Class

4.3 - Hazardous materials which set free flammable gases upon contact with water

WGK

WGK 3

PPE (personal protective equipment)

Eyeshields, Faceshields, Gloves, type P3 (EN 143) respirator cartridges

Hazard Classifications

Flam. Sol. 1 - Skin Corr. 1B - Water-react. 2

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