767522
Tungsten
sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis
Synonym(s):
W
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About This Item
Empirical Formula (Hill Notation):
W
CAS Number:
Molecular Weight:
183.84
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
12352103
EC Number:
231-143-9
MDL number:
assay
99.95% trace metals basis
form
pieces
reaction suitability
core: tungsten
resistivity
4.9 μΩ-cm, 20°C
diam. × thickness
2.00 in. × 0.25 in.
bp
5660 °C (lit.)
mp
3410 °C (lit.)
density
19.3 g/mL at 25 °C (lit.)
SMILES string
[W]
InChI
1S/W
InChI key
WFKWXMTUELFFGS-UHFFFAOYSA-N
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
Storage Class
11 - Combustible Solids
wgk
nwg
flash_point_f
Not applicable
flash_point_c
Not applicable
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