339164ALDRICH

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近十年来出现了原子层沉积（ALD）技术以满足各种需求，包括半导体器件小型化、多孔结构上的保形沉积和纳米颗粒涂层。ALD基于两个相继的自限性表面反应。

Molecular Layer Deposition of Organic and Hybrid Organic-Inorganic Polymers

Atomic layer deposition (ALD) techniques have emerged in the last ten years to meet various needs including semiconductor device miniaturization, conformal deposition on porous structures and coating of nanoparticles. ALD is based on two sequential self-limiting surface reactions.

Nanostructured Materials Through Ultrasonic Spray Pyrolysis

The diversity of applications and nanostructured materials accessible using ultrasonic spray methods are highlighted in this article.

Recent Progress in Spintronic Materials

Spin-based electronic (spintronic) devices offer significant improvement to the limits of conventional charge-based memory and logic devices which suffer from high power usage, leakage current, performance saturation, and device complexity.

Nanostructured Materials Through Ultrasonic Spray Pyrolysis

Ultrasonic spray pyrolysis (USP) is effective for preparing a wide array of materials and is scalable and continuous. Nanomaterials prepared by USP include nanoporous metal oxides and sulfides, nanocomposites, semiconductor quantum dots, and conductive metal inks.

Nanowire Synthesis: From Top-Down to Bottom-Up

The properties of many devices are limited by the intrinsic properties of the materials that compose them.

Atomic Layer Deposition of Nanomaterials for Li-Ion Batteries, Fuel Cells, and Solar Cells

Nanomaterials are considered a route to the innovations required for large-scale implementation of renewable energy technologies in society to make our life sustainable.