Spin-based electronic (spintronic) devices offer significant improvement to the limits of conventional charge-based memory and logic devices which suffer from high power usage, leakage current, performance saturation, and device complexity.
The conductivity of organic semiconductors can be increased, and the barriers to charge-carrier injection from other materials can be reduced, by the use of highly reducing or oxidizing species to n- or p-dope, respectively, the semiconductor.
In recent years considerable interest in ALD has emerged, mainly due to its ability to controllably coat even very small structures, e.g. nanoor microstructures.
Silylethyne substitution offers an opportunity to tune solubility for application-specific needs and self-assembly for electronic performance and has yielded semiconductors with excellent device performance.
The production of hydrogen by catalytic water splitting is important for a wide range of industries including renewable energy petroleum refining and for the production of methanol and ammonia in the chemical industry.
Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.
Compare RO vs. EDI vs. ion exchange resins to remove silica from water for silica-sensitive applications (e.g. microelectronics, testing chambers, autoclaves, sterilizers, …).