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440159

3-(三甲氧基甲硅基)甲基丙烯酸丙酯

98%

别名:

Dow Corning® 产品 Z-6030, [3-(甲基丙烯酰氧基)丙基]三甲氧基硅烷, 硅烷 A174

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关于此项目

线性分子式:
H2C=C(CH3)CO2(CH2)3Si(OCH3)3
化学文摘社编号:
2530-85-0
分子量:
248.35
UNSPSC Code:
12162002
NACRES:
NA.23
PubChem Substance ID:
24867572
EC Number:
219-785-8
Beilstein/REAXYS Number:
1952435
MDL number:
MFCD00008593
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Quality Level

200

assay

98%

form

liquid

impurities

1% methyl alcohol from hydrolysis

refractive index

n20/D 1.431 (lit.)

bp

190 °C (lit.)

density

1.045 g/mL at 25 °C (lit.)

SMILES string

CO[Si](CCCOC(=O)C(C)=C)(OC)OC

InChI

1S/C10H20O5Si/c1-9(2)10(11)15-7-6-8-16(12-3,13-4)14-5/h1,6-8H2,2-5H3

InChI key

XDLMVUHYZWKMMD-UHFFFAOYSA-N

General description

3-(三甲氧基甲硅基)甲基丙烯酸丙酯(TMPSM)广泛用作聚合反应中单体和偶联剂。它可以与其它单体（如苯乙烯或丙烯酸酯）共聚，生成具有改善的机械性质并粘附各种基质的聚合物膜。它也改善聚合物在紫外辐射下的稳定性。此外，TMSPMA 也可用作聚合物凝胶中的交联剂，因为它与其它官能团（如羟基或羧基）反应，形成稳定的共价键，这种共价键改善了聚合物的机械性质。此外，TMSPMA也已被用于各种领域，包括锂离子电池、工程应用牙科修复材料和各种生物医学应用。

Application

牙科修复材料的发展进展
3-(三甲氧基甲硅基)甲基丙烯酸丙酯（TMSPMA）可用作：
  • 用于合成TMSPMA-聚倍半硅氧烷（POSS）杂合物基支架的连接分子，其潜在用途为组织工程应用。
  • 用于制备可见光固化聚氨酯修饰环氧丙烯酸酯/SiO2 复合材料的偶联剂，以改善填料、SiO2 纳米颗粒和树脂基质的粘合。这些复合材料可用作牙科修复材料。
  • 合成用于锂离子电池的聚合物电解质材料的单体。
  • 修饰TiO2纳米颗粒的硅烷偶联剂。TMPSM修饰的纳米TiO2在水中稳定性高，适合用于聚合物纳米复合材料加工。
  • 通过原子转移自由基聚合反应合成活性嵌段共聚物的单体。这些嵌段共聚物可用于构建各种杂化纳米材料。
TMPSM功能化Ag-Ce纳米复合材料可用于通过量热法选择性检测Hg(ll)。在Hg(ll)离子存在的情况下，TMPSM功能化复合材料会明显变色并形成聚集体，适合用于量热法检测。

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存储类别

10 - Combustible liquids

wgk

WGK 1

flash_point_f

197.6 °F - closed cup

flash_point_c

92 °C - closed cup

ppe

Eyeshields, Gloves, type ABEK (EN14387) respirator filter

历史批次信息供参考:

分析证书(COA)

Lot/Batch Number
MKDB4070
MKCW0519
MKCZ9773
MKCZ4751
MKCZ4151

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货号GTIN
440159-500ML04061837406942
440159-100ML04061837406935