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InChI key
XDLMVUHYZWKMMD-UHFFFAOYSA-N
InChI
1S/C10H20O5Si/c1-9(2)10(11)15-7-6-8-16(12-3,13-4)14-5/h1,6-8H2,2-5H3
SMILES string
CO[Si](CCCOC(=O)C(C)=C)(OC)OC
assay
98%
form
liquid
impurities
1% methyl alcohol from hydrolysis
refractive index
n20/D 1.431 (lit.)
bp
190 °C (lit.)
density
1.045 g/mL at 25 °C (lit.)
Quality Level
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General description
Application
- 用于合成TMSPMA-聚倍半硅氧烷(POSS)杂合物基支架的连接分子,其潜在用途为组织工程应用。
- 用于制备可见光固化聚氨酯修饰环氧丙烯酸酯/SiO2 复合材料的偶联剂,以改善填料、SiO2 纳米颗粒和树脂基质的粘合。这些复合材料可用作牙科修复材料。
- 合成用于锂离子电池的聚合物电解质材料的单体。
- 修饰TiO2纳米颗粒的硅烷偶联剂。TMPSM修饰的纳米TiO2在水中稳定性高,适合用于聚合物纳米复合材料加工。
- 通过原子转移自由基聚合反应合成活性嵌段共聚物的单体。这些嵌段共聚物可用于构建各种杂化纳米材料。
存储类别
10 - Combustible liquids
wgk
WGK 1
flash_point_f
197.6 °F - closed cup
flash_point_c
92 °C - closed cup
ppe
Eyeshields, Gloves, type ABEK (EN14387) respirator filter
商品
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