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Merck
CN

403342

Sigma-Aldrich

乙酸亚铜

97%

别名:

乙酸亚铜, 单醋酸铜

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线性分子式:
CuCO2CH3
化学文摘社编号:
分子量:
122.59
EC 号:
MDL编号:
UNSPSC代码:
12352103
PubChem化学物质编号:
NACRES:
NA.23
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质量水平

方案

97%

表单

powder and chunks

反应适用性

core: copper
reagent type: catalyst

mp

250 °C (dec.) (lit.)

SMILES字符串

CC(=O)O[Cu]

InChI

1S/C2H4O2.Cu/c1-2(3)4;/h1H3,(H,3,4);/q;+1/p-1

InChI key

RFKZUAOAYVHBOY-UHFFFAOYSA-M

相关类别

一般描述

Copper(II) acetate hydrate is a high-purity (98%), blue crystalline solid widely used as a versatile precursor for copper-based materials. Its hydrate form enhances solubility in aqueous/organic solvents, facilitating solution processing for advanced applications. Recent research emphasizes its role in sustainable energy technologies, catalysis, and functional nanomaterials, aligning with trends in green chemistry and renewable energy.

应用

乙酸铜(CuOAc)曾用作制备铜纳米粒子和CuAlO2 p型纳米结构半导体的起始物料。

储存分类代码

11 - Combustible Solids

WGK

WGK 3

闪点(°F)

Not applicable

闪点(°C)

Not applicable

个人防护装备

dust mask type N95 (US), Eyeshields, Gloves


历史批次信息供参考:

分析证书(COA)

Lot/Batch Number

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Room?Temperature Formation of Hollow Cu2O Nanoparticles.
Hung LI, et al.
Advanced Materials, 22.17, 1910-1914 (2010)
Synthesis of delafossite CuAlO 2 p-type semiconductor with a nanoparticle-based Cu (I) acetate-loaded boehmite precursor
Thu TV, et al.
Mat. Res. Bul., 46.11, 1819-1827 (2011)
Preparation of superhydrophobic films on copper substrate for corrosion protection
Fan, Youhua and Chen, et al.
Surface and Coatings Technology, 244, 1-8 (2014)
Atomic layer deposition of photoconductive Cu2O thin films
Iivonen, et al.
ACS Omega, 4, 11205-11214 (2019)
Jan Lorkowski et al.
Chemistry (Weinheim an der Bergstrasse, Germany), 25(48), 11365-11374 (2019-07-06)
Cyclic (amino)(aryl)carbenes (cAArCs) based on the isoindoline core were successfully generated in situ by α-elimination of 3-alkoxyisoindolines at high temperatures or by deprotonation of isoindol-2-ium chlorides with sodium or copper(I) acetates at low temperatures. 3-Alkoxy-isoindolines 2 a,b-OR (R=Me, Et, iPr) have

商品

Copper metal deposition processes are an essential tool for depositing interconnects used in microelectronic applications, giving group 11 (coinage metals: Copper, Silver, and Gold) an important place in atomic layer deposition (ALD) process development.

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