General description
Tantalum nitride etchant is a high purity etchant systems for precise, clean etching of tantalum, tantalum nitride, and tantalum oxide thin films and resists in electronics applications.
Application
在电子应用中可作为精确清洁地蚀刻钽、氮化钽和氧化钽薄膜和防蚀涂层的蚀刻溶液。
Features and Benefits
25°C 时腐蚀速度为 70-80Å/秒。与金正性或负性光致抗蚀剂共同使用。用去离子水冲洗。
Preparation Note
- Etch times vary depending on material type (Ta, TaN, or Ta2O5) and purity.
- Dilute with water or lower the temperature to achieve a lower etch rate. Adding 1 part water to 2 parts etchant or reducing the temperature 10 °C will approximately reduce the etch rate by 50%.
- Parts to be etched should be placed in etchant solution with mild to moderate mechanical agitation.
- Tantalum Etchants contain hydrofluoric acid and will attack silicon oxides, titanium, nickel, aluminum, and chromium.
- Gold would be the ideal etch stop. You might also succeed with tungsten
- Rinse with Deionized water.
signalword
Danger
Hazard Classifications
Acute Tox. 1 Dermal - Acute Tox. 2 Oral - Acute Tox. 3 Inhalation - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A
supp_hazards
存储类别
6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter
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