749044
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sputtering target, diam. × thickness 3.00 in. × 0.125 in., 99.995% trace metals basis
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关于此项目
经验公式（希尔记法）:
Ti
化学文摘社编号:
分子量:
47.87
UNSPSC Code:
12352103
PubChem Substance ID:
EC Number:
231-142-3
MDL number:
assay
99.995% trace metals basis
form
solid
autoignition temp.
860 °F
reaction suitability
core: titanium
resistivity
42.0 μΩ-cm, 20°C
diam. × thickness
3.00 in. × 0.125 in.
bp
3287 °C (lit.)
mp
1660 °C (lit.)
density
4.5 g/mL at 25 °C (lit.)
SMILES string
[Ti]
InChI
1S/Ti
InChI key
RTAQQCXQSZGOHL-UHFFFAOYSA-N
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. It is commonly used for thin-film deposition, etching and analytical techniques.
存储类别
11 - Combustible Solids
wgk
nwg
flash_point_f
Not applicable
flash_point_c
Not applicable
法规信息
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Dahn, J. R.; Trussler, S.; Hatchard, T. D.; Bonakdarpour, B. et al.
Chemistry of Materials, 14, 3519-3519 (2002)
Hahn, H.; Averback, R. S.
Journal of Applied Physics, 67, 1113-1113 (1990)
Oechsner, H.
Applied Physics. A, Materials Science & Processing, 8, 185-185 (1975)
全球贸易项目编号
| 货号 | GTIN |
|---|---|
| 749044-1EA | 04061826707609 |