InChI key
OKTJSMMVPCPJKN-UHFFFAOYSA-N
InChI
1S/C
description
EMI Shielding: 53 dB @30 MHz, 58 dB @ 1.5 GHz
form
sheet
resistivity
(Electrical resistivity: surface 0.06 Ω/sq, sheet 2.7 μΩ−m)
sheet size
11.5 in. × 23.5 in.
thickness
50 μm
conductivity
(Electrical conductivity: 3700 S/cm (in-plane)), (Thermal conductivity: 550 W/mK (in-plane), 3 W/mK (through plane))
density
1.9 g/cm3
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Application
XG Leaf® is a more effective solution than aluminum and copper foils for a wide variety of applications to optimize thermal conductivity, thermal spreading, electrical properties, and corrosion resistance.
XG Leaf® is a thin, flexible and lightweight sheet product built on a foundation of XG
sciences, xGnP® graphene nanoplatelets. By precisely tailoring the composition, density, and
our proprietary manufacturing process, materials are created with unique properties to optimize thermal and electrical conductivity. Different types of XG Leaf® graphene paper offer outstanding thermal and electrical properties.
Potential applications include:
XG Leaf® is a thin, flexible and lightweight sheet product built on a foundation of XG
sciences, xGnP® graphene nanoplatelets. By precisely tailoring the composition, density, and
our proprietary manufacturing process, materials are created with unique properties to optimize thermal and electrical conductivity. Different types of XG Leaf® graphene paper offer outstanding thermal and electrical properties.
- Thermal conductivity and spreading: In-plane conductivity above 550 W/mK.
- Electrical properties: Formulations are available with surface resistivity ranging as low as 0.04 Ω/sq.
Potential applications include:
- heat dissipation
- resistive heating
- EMI shielding
- electrodes (thin battery, super capacitor, Li-air etc)
- barrier
- layering in composites
- sensors
Legal Information
XG Leaf is a registered trademark of XG Sciences, Inc.
xGnP is a registered trademark of XG Sciences, Inc.
存储类别
11 - Combustible Solids
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable
法规信息
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Advances in scalable synthesis and processing of two-dimensional materials
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