form
liquid
General description
Buffered oxide etchant (BOE) is a wet etchant used in microfabrication. Its primary use is in etching thin films of silicon dioxide (SiO2) or silicon nitride (Si3N4). It is a mixture of a buffering agent, such as ammonium fluoride (NH4F), and hydrofluoric acid (HF). Concentrated HF etches silicon dioxide too quickly for good process control and also peels photoresist used in lithographic patterning.
Application
Buffered oxide etchant (BOE) 10:1 with surfactant can be potentially used in the etching of titanium carbide, which is used in the fabrication of microelectromechanical systems (MEMS). It may be used in the etching of spin-on-dopant (SOD) for the development of conductor-insulator-conductor tunneling diodes. It may also be used to enhance the surface of fused quartz devices.
signalword
Danger
hcodes
Hazard Classifications
Acute Tox. 2 Dermal - Acute Tox. 3 Inhalation - Acute Tox. 3 Oral - Eye Dam. 1 - Skin Corr. 1B
存储类别
6.1B - Non-combustible acute toxic Cat. 1 and 2 / very toxic hazardous materials
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable
Study on surface roughness improvement of Fused Quartz after thermal and chemical post-processing
2016 IEEE International Symposium on Inertial Sensors and Systems, 31(8), 101-104 (2016)
Integration of wear-resistant titanium carbide coatings into MEMS fabrication processes
Radhakrishnan G, et al.
Tribology Letters, 8(2-3), 133-137 (2000)
New process development for planar-type CIC tunneling diodes
Choi K, et al.
IEEE Electron Device Letters, 31(8), 809-811 (2010)
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