form
liquid
color
green
optimum pH
3.2
General description
An electroless nickel plating process designed for electroless nickel plating on copper, brass and copper alloy
CLEANING PROCEDURE FOR COPPER SAMPLES:
1. Clean copper with some physical abrasion.
2. Dip for one minute in alkaline cleaner at 65°C (150°F).
3. Rinse with deionized water.
4. Dip for one minute in 30% HCl
5. Rinse with deionized water.
PLATING BATH - USE AND CONTROL
Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (electroless nickel plating solution, ammonia free). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.
CLEANING PROCEDURE FOR COPPER SAMPLES:
1. Clean copper with some physical abrasion.
2. Dip for one minute in alkaline cleaner at 65°C (150°F).
3. Rinse with deionized water.
4. Dip for one minute in 30% HCl
5. Rinse with deionized water.
PLATING BATH - USE AND CONTROL
Operate bath at 95 °C. Plate for approximately one minute until surface of sample is completely nickel plated, then rinse with water. For build up of nickel deposit, use Nickelex (electroless nickel plating solution, ammonia free). Maintain pH of plating solution at 2.8 to 3.5 by adding ammonium hydroxide when pH falls below 2.8.
signalword
Danger
Hazard Classifications
Acute Tox. 4 Inhalation - Acute Tox. 4 Oral - Aquatic Chronic 2 - Carc. 1A Inhalation - Muta. 2 - Repr. 1B - Resp. Sens. 1 - Skin Irrit. 2 - Skin Sens. 1 - STOT RE 1
target_organs
Lungs
存储类别
6.1C - Combustible acute toxic Cat.3 / toxic compounds or compounds which causing chronic effects
wgk
WGK 3
flash_point_f
230.7 °F
flash_point_c
110.4 °C
法规信息
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