Quality Level
General description
钨腐蚀剂是一种基于氢氧化钾和铁氰化钾溶液的混合物,可通过将基底浸入蚀刻溶液中而有助于将钨和铝等材料进行去除。
Application
半导体和微电子技术中钨薄膜金属化的选择性蚀刻剂。蚀刻剂是缓冲式、温和碱性铁氰化物配方,提供高分辨率图案,具有最小切割和光刻胶兼容性。蚀刻剂可直接使用(不需要稀释)。可控、均匀蚀刻是通过浸渍或喷雾蚀刻技术实现的。蚀刻能力(速率在∼70%时下降)为64 g/加仑。建议工作温度:20-80 °C(30-40 °C最常用)
Preparation Note
- 20°C = 30 Å/秒
- 30°C = 140 Å/秒 20°C = 80 Å/秒
- 60°C = 250 Å/秒
signalword
Danger
hcodes
Hazard Classifications
Aquatic Chronic 3 - Eye Dam. 1 - Met. Corr. 1 - Skin Corr. 1A
supp_hazards
存储类别
8B - Non-combustible corrosive hazardous materials
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable
ppe
Faceshields, Gloves, Goggles, type ABEK (EN14387) respirator filter
Electrostatically actuated copper-blade microrelays.
Lee H, et al.
Sensors and actuators A, Physical, 100(1), 105-113 (2002)
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Novembre AE, et al.
Microelectronic Engineering, 46(1-4), 271-274 (1999)
Microstructure Evolution of W-Cu Alloy Wire.
Shao F, et al.
Materials Sciences and Applications, 3(03), 157-157 (2012)
全球贸易项目编号
| 货号 | GTIN |
|---|---|
| 667498-500ML | 04061838148049 |
