767484
镍
sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis
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关于此项目
线性分子式:
Ni
化学文摘社编号:
分子量:
58.69
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
11101706
EC Number:
231-111-4
MDL number:
Quality Segment
assay
99.95% trace metals basis
form
solid
reaction suitability
core: nickel
resistivity
6.97 μΩ-cm, 20°C
diam. × thickness
2.00 in. × 0.25 in.
bp
2732 °C (lit.)
mp
1453 °C (lit.)
density
8.9 g/mL at 25 °C (lit.)
SMILES string
[Ni]
InChI
1S/Ni
InChI key
PXHVJJICTQNCMI-UHFFFAOYSA-N
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
警示词
Danger
危险代码
Hazard Classifications
Carc. 2 - Skin Sens. 1 - STOT RE 1
存储类别
6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects
怎么回事？
WGK 2
闪点 (F)
Not applicable
闪点 (°C)
Not applicable