质量水平
方案
99.95% trace metals basis
表单
solid
反应适用性
core: nickel
电阻率
6.97 μΩ-cm, 20°C
直径× 厚度
2.00 in. × 0.25 in.
沸点
2732 °C (lit.)
mp
1453 °C (lit.)
密度
8.9 g/mL at 25 °C (lit.)
SMILES字符串
[Ni]
InChI
1S/Ni
InChI key
PXHVJJICTQNCMI-UHFFFAOYSA-N
应用
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
警示用语：
Danger
危险声明
危险分类
Carc. 2 - Skin Sens. 1 - STOT RE 1
储存分类代码
6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects
WGK
WGK 2
闪点(°F)
Not applicable
闪点(°C)
Not applicable
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