Merck
CN

767484

Sigma-Aldrich

sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis

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经验公式(希尔记法):
Ni
CAS号:
分子量:
58.69
EC 号:
MDL编号:
PubChem化学物质编号:
NACRES:
NA.23

质量水平

检测方案

99.95% trace metals basis

形式

solid

反应适用性

core: nickel

电阻率

6.97 μΩ-cm, 20°C

直径× 厚度

2.00 in. × 0.25 in.

bp

2732 °C (lit.)

mp

1453 °C (lit.)

密度

8.9 g/mL at 25 °C (lit.)

SMILES字符串

[Ni]

InChI

1S/Ni

InChI key

PXHVJJICTQNCMI-UHFFFAOYSA-N

应用

Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.

象形图

Exclamation markHealth hazard

警示用语:

Danger

危险声明

危险分类

Carc. 2 - Skin Sens. 1 - STOT RE 1

储存分类代码

6.1D - Non-combustible, acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects

WGK

WGK 2

闪点(°F)

Not applicable

闪点(°C)

Not applicable

法规信息

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Helmersson; U.; et al.
Thin Solid Films, 513, 1-1 (2006)
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