767484
镍
sputtering target, diam. × thickness 2.00 in. × 0.25 in., 99.95% trace metals basis
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关于此项目
经验公式（希尔记法）:
Ni
化学文摘社编号:
分子量:
58.69
NACRES:
NA.23
PubChem Substance ID:
UNSPSC Code:
11101706
EC Number:
231-111-4
MDL number:
Quality Segment
assay
99.95% trace metals basis
form
solid
reaction suitability
core: nickel
resistivity
6.97 μΩ-cm, 20°C
diam. × thickness
2.00 in. × 0.25 in.
bp
2732 °C (lit.)
mp
1453 °C (lit.)
density
8.9 g/mL at 25 °C (lit.)
SMILES string
[Ni]
InChI
1S/Ni
InChI key
PXHVJJICTQNCMI-UHFFFAOYSA-N
Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
signalword
Danger
hcodes
Hazard Classifications
Carc. 2 - Skin Sens. 1 - STOT RE 1
存储类别
6.1D - Non-combustible acute toxic Cat.3 / toxic hazardous materials or hazardous materials causing chronic effects
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable