质量水平
方案
99.995% trace metals basis
表单
solid
自燃温度
860 °F
反应适用性
core: titanium
电阻率
42.0 μΩ-cm, 20°C
直径× 厚度
2.00 in. × 0.25 in.
沸点
3287 °C (lit.)
mp
1660 °C (lit.)
密度
4.5 g/mL at 25 °C (lit.)
SMILES字符串
[Ti]
InChI
1S/Ti
InChI key
RTAQQCXQSZGOHL-UHFFFAOYSA-N
应用
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition.
储存分类代码
11 - Combustible Solids
WGK
nwg
闪点(°F)
Not applicable
闪点(°C)
Not applicable
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