InChI key
XUIMIQQOPSSXEZ-UHFFFAOYSA-N
InChI
1S/Si
SMILES string
[Si]
assay
99.999% trace metals basis
form
solid
reaction suitability
core: silicon
diam. × thickness
2.00 in. × 0.25 in.
bp
2355 °C (lit.)
mp
1410 °C (lit.)
density
2.33 g/mL at 25 °C (lit.)
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Application
Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic particles. The extreme miniaturization of components in the semiconductor and electronics industry requires high purity sputtering targets for thin film deposition
flash_point_f
Not applicable
flash_point_c
Not applicable
存储类别
11 - Combustible Solids
wgk
nwg
法规信息
新产品
此项目有
Kostantinidis, S.; et al.
The European Physical Journal - Applied Physics, 56, 24002/1-24002/1 (2011)
Helmersson; U.; et al.
Thin Solid Films, 513, 1-1 (2006)
Chengyong Li et al.
Journal of nanoscience and nanotechnology, 13(3), 2272-2275 (2013-06-13)
Mesoporous Si-C-O fibers were fabricated by air activation of a kind of carbon-rich SiC-C fibers at 600 degrees C. The SiC-C fibers were prepared from the hybrid precursor of polycarbosilane and pitch through melt-spinning, air curing and pyrolysis in nitrogen.
Bo-Soon Kim et al.
Journal of nanoscience and nanotechnology, 13(5), 3622-3626 (2013-07-19)
A subwavelength structure (SWS) was formed via a simple chemical wet etching using a gold (Au) catalyst. Single nano-sized Au particles were fabricated by metallic self-aggregation. The deposition and thermal annealing of the thin metallic film were carried out. Thermal
K W Urban et al.
Physical review letters, 110(18), 185507-185507 (2013-05-21)
Newly developed achromatic electron optics allows the use of wide energy windows and makes feasible energy-filtered transmission electron microscopy (EFTEM) at atomic resolution. In this Letter we present EFTEM images formed using electrons that have undergone a silicon L(2,3) core-shell
商品
Nanocomposite Coatings with Tunable Properties Prepared by Atomic Layer Deposition
Spintronics offer breakthroughs over conventional memory/logic devices with lower power, leakage, saturation, and complexity.
The properties of many devices are limited by the intrinsic properties of the materials that compose them.
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