grade
certified reference material
agency
IRMM®
manufacturer/tradename
JRC
resistivity
1.673 μΩ-cm, 20°C
bp
2567 °C (lit.)
mp
1083.4 °C (lit.)
density
8.94 g/mL at 25 °C (lit.)
format
matrix material
SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Application
Copper may be used as a standard reference material in studying the thermal expansion coefficient of different available grades of copper like high purity copper, tough pitch copper and oxygen-free high-conductivity copper using absolute laser interferometric dilatometer.
Analysis Note
For more information please see:
IRMM522A
IRMM522A
Legal Information
IRMM is a registered trademark of European Commission
存储类别
11 - Combustible Solids
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable