grade
certified reference material
agency
IRMM®
manufacturer/tradename
JRC
resistivity
1.673 μΩ-cm, 20°C
bp
2567 °C (lit.)
mp
1083.4 °C (lit.)
density
8.94 g/mL at 25 °C (lit.)
format
matrix material
SMILES string
[Cu]
InChI
1S/Cu
InChI key
RYGMFSIKBFXOCR-UHFFFAOYSA-N
Application
Copper may be used as a standard reference material in studying the thermal expansion coefficient of different available grades of copper like high purity copper, tough pitch copper and oxygen-free high-conductivity copper using absolute laser interferometric dilatometer.
Analysis Note
For more information please see:
IRMM522A
IRMM522A
Legal Information
IRMM is a registered trademark of European Commission
存储类别
11 - Combustible Solids
wgk
WGK 2
flash_point_f
Not applicable
flash_point_c
Not applicable
Measurements of linear thermal expansion coefficients of copper SRM 736 and some commercially available coppers in the temperature range 20?300 K by means of an absolute interferometric dilatometer
Okaji.M, et al.
Cryogenics, 37(5), 251-254 (1997)
Kessarin Thanapirom et al.
Journal of the Medical Association of Thailand = Chotmaihet thangphaet, 96(2), 150-156 (2013-08-14)
Wilson's disease (WD) is an inherited disorder of copper metabolism, leading to hepatic and neuropsychiatric manifestations. The long-term outcome of patients with Wilson's disease presenting with acute liver failure (ALF) versus those with acute-on-chronic liver failure (ACLF) has not been
Xuejiao Tong et al.
Journal of environmental sciences (China), 25(4), 652-658 (2013-08-09)
The removal efficiency of copper (Cu(II)) from an actual acidic electroplating effluent by biochars generated from canola, rice, soybean and peanut straws was investigated. The biochars simultaneously removed Cu(II) from the effluent, mainly through the mechanisms of adsorption and precipitation
全球贸易项目编号
| 货号 | GTIN |
|---|---|
| IRMM522A-1EA | 04061832660530 |