- The effect of growth temperature variation on partially bismuth filled carbon nanotubes synthesis using a soft semi-metallic template.
The effect of growth temperature variation on partially bismuth filled carbon nanotubes synthesis using a soft semi-metallic template.
Journal of nanoscience and nanotechnology (2014-04-18)
R K Sahoo, C Jacob
PMID24738435
摘要
The dewetting of a low melting point metal thin film deposited on silicon substrates was studied. The experimental results suggest that the change in the growth temperature affects the nanostructures that form. Based on the experimental results, the temperature which yielded the smallest features for the growth of nanotubes is determined. The mechanism by which these nano-templates become an efficient seeds for the growth of the carbon nanotubes is discussed. The partial bismuth filling inside the CNTs was optimized. Based on the results, a schematic growth model for better understanding of the process parameters has also been proposed.
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硅, wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm
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硅, wafer (single side polished), <111>, N-type, contains no dopant, diam. × thickness 2 in. × 0.5 mm
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硅, wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 3 in. × 0.5 mm
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硅, wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.5 mm
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硅, wafer (single side polished), <100>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm
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硅, wafer (single side polished), <111>, N-type, contains phosphorus as dopant, diam. × thickness 2 in. × 0.5 mm
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硅, wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2 in. × 0.3 mm
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硅, wafer (single side polished), <100>, N-type, contains phosphorus as dopant, diam. × thickness 2 in. × 0.5 mm
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硅, wafer (single side polished), <100>, N-type, contains phosphorus as dopant, diam. × thickness 3 in. × 0.5 mm
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硅, wafer (single side polished), <111>, P-type, contains boron as dopant, diam. × thickness 3 in. × 0.5 mm
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硅, wafer (single side polished), <111>, N-type, contains no dopant, diam. × thickness 3 in. × 0.5 mm
硅, sheet, 52x52mm, thickness 1.0mm, polycrystalline, 99.999%
硅, disks, 15.9mm, thickness 0.38mm, single crystal, n-type, 100%
铋, foil, not light tested, 50x50mm, thickness 0.01mm, permanent polyester support, 99.97%
硅, sheet, 10x10mm, thickness 0.5mm, single crystal, -100, 100%
硅, sheet, 10x10mm, thickness 0.6mm, single crystal, -100, 100%
铋, foil, 25x25mm, thickness 0.25mm, 100%
硅, rod, 80mm, diameter 20mm, single crystal, -100, 99.999%
硅, sheet, 40x40mm, thickness 3.0mm, single crystal, p-type, 100%
硅, rod, 40mm, diameter 20mm, single crystal, -100, 99.999%
铋, foil, light tested, 50x50mm, thickness 0.02mm, permanent polyester support, 99.97%
硅, disks, 13mm, thickness 0.38mm, single crystal, 100%